Cutting Brittle Optical Materials Without Compromise: The Case for Micro-Abrasive Waterjet
In optical manufacturing, a single subsurface crack turns a component into scrap. Laser and mechanical dicing leave heat-affected zones and edge chipping in fused silica, sapphire and glass. Here is why cold micro-abrasive waterjet cutting changes the equation for photonics — with no HAZ and micron-level precision.